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  • Buku yang Dikarang by Gilbert B. Chapman II

    Nondestructive Evaluation of Adhesive Bonds Using 20 Mhz and 25 Khz Ultrasonic Frequencies on Metal and Polymer Assemblies
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    Nondestructive Evaluation of Adhesive Bonds Using 20 Mhz and 25 Khz Ultrasonic Frequencies on Metal and Polymer Assemblies
    Gilbert B. Chapman II